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氮化铝陶瓷基板

Aluminum Nitride (AIN) Ceramics Substrate/AlN Substrate/AlN Baseplate

AlN ceramic substrates have the characteristics of high thermal conductivity,good mechanical properties,corrosion resistance,excellent electrical properties,and weldability.They are ideal heat dissipation substrates and packaging materials for large-scale integrated circuits.

Aluminum Nitride (AIN) Ceramics Substrate/AlN Substrate/AlN Baseplate

 

Performance parameter table of AlN substrate

 

 

Product Features

1.Standard thermal conductivity 175W/m·k,high thermal conductivity 200W/m·k, ultra high thermal conductivity 230W/m·k

2.Provide customized services, which can customize substrates such as grinding type,instant firing type,high bending resistance,high thermal conductivity,polishing type,and lasers cribing type.

3.Suitable for various metallization:DPC,DBC,TPC,AMB,thick film printing,thin film printing,etc.

4.The thinnest thickness can reach 0.1mm。