AlN ceramic substrates have the characteristics of high thermal conductivity,good mechanical properties,corrosion resistance,excellent electrical properties,and weldability.They are ideal heat dissipation substrates and packaging materials for large-scale integrated circuits.

AlN ceramic substrates have the characteristics of high thermal conductivity,good mechanical properties,corrosion resistance,excellent electrical properties,and weldability.They are ideal heat dissipation substrates and packaging materials for large-scale integrated circuits.

AlN ceramic structural parts have excellent properties such as high thermal conductivity, low dielectric loss, good mechanical properties, high hardness, good toughness, high temperature and corrosion resistance. They can be used to make semiconductor electrostatic suction cups, high-temperature and corrosion resistant components, and are widely used in semiconductor, medical, and other fields.

Alumina ceramic substrates are widely used in electronic devices, optoelectronic devices, solid oxide fuel cells, and other fields, providing excellent thermal conductivity, insulation, and mechanical strength to enhance the performance and reliability of equipment.